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Electronics

Projects/Programs

Keyword

Organizational Unit

Metrology for extreme ultraviolet lithography

Ongoing

Patterning with light 13 nm brings a host a new challenges Light at 13 nm is well within the vacuum ultraviolet, where radiation is strongly absorbed by all materials. This requires that the technology take place in vacuum and rely on mirrors rather than lenses. Moreover generating sufficient

RF Metrology for High-Frequency Transistor Models

Ongoing

Due to the challenges of high-frequency measurements, that includes inaccuracy in on-wafer calibration and a lack of instrumentation for transistor characterization, models are currently extracted from low frequency measurements and extrapolated to higher frequencies. This methodology has been shown

Metrology for Integration of New Magnetic Materials

Ongoing

Integration of magnetic materials remains a key challenge facing advanced packaging technologies. High power applications require voltage conversion at or near the die, and most practical power converters rely on inductors. Beyond power electronics, integration of magnetic components such as

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Ongoing

The most important part of any bonding process is getting the surfaces to stick. While the physical properties of the films, surfaces, and interfaces in conjunction with the bonding process parameters (pressure, duration, temperature, and post bond anneal) all play important roles, altering the

Metrology of the Ohm

Ongoing

The Metrology of the Ohm Project has been a leader in providing internationally consistent resistance standards that are readily available to support the scientific and industrial foundations of the U.S. economy. Through this very broad customer base, the activities of the project enable cost

Metrology of Purity and Contaminants in Solid Materials

Ongoing

Purity evaluations of high-purity bulk materials used in chips manufacturing are calibrated against reference materials that are often not matrix-matched to the materials under test. In other words, differences in the compositions of the calibrants and the samples being analyzed can result in large

A micromechanical bulk acoustic resonator that uses phononic crystal tethers to achieve a quality factor approaching the fundamental dissipation limit (fxQ can be as large as 1.2 x 1013 Hz)

Micro- and Nanoelectromechanical Systems

Completed

MEMS/NEMS are enabling technologies that bring new functionalities with the potential to radically transform markets ranging from consumer products to national defense. The meteoric rise of the smartphone is an excellent example, in which MEMS accelerometers, gyroscopes, microphones, displays, and

Molecular Dynamics Simulation of Heat Transport in Gate-All-Around Transistors

Ongoing

Thermal efficiency of semiconductor devices is pivotal to their operation and performance, especially now that the dimensions of transistor features are rapidly shrinking to the nanoscale. A significant knowledge gap persists in accurately describing and quantifying heat dissipation at such scales

Multiscale Modeling and Validation of Semiconductor Materials and Devices

Ongoing

The limitations of scaling traditional CMOS (complementary metal-oxide semiconductors) designs have necessitated that the semiconductor industry consider new materials and design concepts. For wide bandgap semiconductor devices, optimization of materials and fabrication processes is needed to

Nanocalorimetry

Ongoing

The global market for semiconductor chips is $270 billion. Growth in this industry is driven by the need to enhance performance by packing more transistors into the same chip area, with a relationship between feature size and time that approximately follows Moore's Law. As the feature size shrinks

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Ongoing

In September 2022, NIST published a report titled Strategic Opportunities for U.S. Semiconductor Manufacturing , which cited, among other challenges, the need to understand and improve heat dissipation and performance in advanced microelectronics. Specifically, there needs to be better measurements

Nanoelectromagnetics

Ongoing

The primary goal of this program is metrology that enables advanced nanoscale device (including electronics, spintronics, and life science) development. Based on current trends in electronics, we are focusing on metrology for two classes of devices: (1) nanoscale devices utilizing and exploring new

Nanometrology: Composition and Structure of Nanomaterials

Ongoing

Pushing the Limits of Measurement Accuracy in Atom Probe Mass Spectrometry Nanoscale Analysis of Biological and Organic Materials Release from Nanocomposite Consumer Products

Nanophononic Metamaterials for Thermoelectrics

Ongoing

About 68 % of the energy produced in the United States is wasted as heat lost to the environment. About a quarter of this lost heat is present at temperature gradients suitable for recovery with thermoelectric devices, which use the ability of semiconductors to generate electricity directly from

Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

Ongoing

Industry roadmaps identify the characterization of nanoscale subsurface feature shape and composition as a measurement need for the semiconductor industry. However, IC interiors are difficult to probe post-manufacturing due to the presence of many close-packed and nanoscale subsurface features, of

Nanoscale Property Measurements by Atomic Force Microscopy

Ongoing

Over the past several decades, Atomic Force Microscopy (AFM) has advanced from a technique used primarily for surface topography imaging to one capable of characterizing a range of chemical, mechanical, electrical, and magnetic material properties with nanometer resolution. Such characterizations

A scanning electron micrograph of a QDOGFET device used for photon number-resolving detection.

Nanostructure Fabrication and Metrology

Completed

This project develops semiconductor nanostructures, especially self-assembled quantum dots and photonic crystals, for a variety of applications including single photonics, laser diodes, and quantum optical metrology. It also develops quantum optical metrology based on other sources and detectors

The Nanotechnology Xccelerator

Ongoing

The Nanotechnology Xccelerator was announced on September 13, 2022 and was officially accepted for production at Skywater Technology Foundry using the Sky130 technology in Q1 2024. Sky130, which comes in both a conventional and open-source process design kit, is a 5-metal layer process. To

Non-Destructive Semiconductor Structure Function and Process Optimization for future Microelectronics Manufacturing at the NIST NSLS-II Beamline for XAFS and Diffraction

Ongoing

This project relies on the existing NIST Synchrotron beamline for X-ray diffraction (XRD), and X-ray absorption spectroscopy (XAS) to improve measurement capabilities. The proposed equipment enhancements will substantially increase sample throughput and sensitivity. Driving the ability to probe

EDMR set up to measure the electrode process of an electrochemical cell.

Operando Measurements of Electrochemical (Charge-transfer) Processes

Ongoing

There are two ways to study a very fast process such as charge transfer. One can use very high-speed measurement that can follow the effect of the process, or one use a method that is sensitive only to the process itself. Either way has its weakness. Many fast measurements can follow the process

Optical and Microwave Spectroscopy of Microelectronic Systems

Ongoing

Collaborations with industry leaders have led to new understanding of magnetic damping in advanced materials and replication of our magnetic metrology tools. We investigate fundamental aspects of spin transfer in materials and structures that offer improved performance in future devices such as

Optical Probes of 2D Magnetic Phenomena

Ongoing

The unique measurement capabilities developed in this Project enable diffraction-limited, optical spectra (both Raman and photoluminescence) to be collected and analyzed as a function of laser energy, polarization, temperature, magnetic field, and device parameters such as current load and back

Other activities to support government organizations

Ongoing

Recent projects include: Developing uncertainty analyses for an outdoor near-field antenna test rangeWe are analyzing near-field scanning data from the U.S. Army’s Electronic Proving Grounds (EPG) and will then provide technical support to the Army for any necessary corrections to the range’s

Out-of-Band Emissions Measurements of LTE Devices Operating in the AWS-3 Band

Completed

The project, proposed by Edwards Air Force Base, measured Out-of-Band (OoB) emissions from new Long Term Evolution (LTE) systems operating in bands adjacent to existing incumbent Department of Defense (DoD) Aeronautical Mobile Telemetry (AMT) systems used at government test and training ranges (TTRs

Overcoming Barriers: Nanoscale Interface Metrology and Electrical Characterization for Advanced Electronics

Ongoing

“The interface is the device,” Herbert Kroemer, 2000 Nobel Laureate. This is even more true today, twenty-three years later, when device dimensions are measured in numbers of atoms rather than numbers of micrometers. Historically, interface problems in the semiconductor industry have been addressed

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
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----National Advanced Packaging Manufacturing Program Group
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---Finance Division
----Finance - HQ
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-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
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----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
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---Spectrum Technology and Research Division
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----Spectrum Technology and Research – HQ
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----Wireless Networks Division - HQ
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---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
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--Engineering Laboratory
---Building Energy and Environment Division
----Building Energy and Environment - HQ
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----Manipulation and Mobility Systems Group
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---Materials and Structural Systems Division
----Earthquake Engineering Group
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----Infrastructure Materials Group
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----Materials and Structural Systems - HQ
----Polymeric Materials Group
----Structures Group
---Engineering Laboratory Office
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----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
----National Fire Research Laboratory Group
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---Systems Integration Division
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----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
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---Computer Security Division
----Computer Security - HQ
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---Applied and Computational Mathematics Division
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---Statistical Engineering Division
----Applied and Computational Statistics Group
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----Systems Interoperability Group
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---Information Access Division
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---Office of Data and Informatics
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----Data Services Group
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---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
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----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
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----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
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---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
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-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
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----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
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---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ