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Search Publications by: Yaw S. Obeng (Fed)

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Displaying 51 - 75 of 172

Microwave Monitoring of Atmospheric Corrosion of Interconnects

December 28, 2018
Author(s)
Papa Amoah, Dmitry Veksler, Christopher E. Sunday, Stephane Moreau, David Bouchu, Yaw S. Obeng
Traditional metrology has been unable to adequately address the reliability needs of emerging integrated circuits at the nano scale; thus, new metrology and techniques are needed. In this paper, we use microwave propagation characteristics (insertion

Metrology for the next generation of semiconductor devices

October 12, 2018
Author(s)
Ndubuisi G. Orji, Mustafa Badaroglu, Bryan M. Barnes, Carlos Beitia, Benjamin D. Bunday, Umberto Celano, Regis J. Kline, Mark Neisser, Yaw S. Obeng, Andras Vladar
The semiconductor industry continues to produce ever smaller devices that are ever more complex in shape and contain ever more types of materials. The ultimate sizes and functionality of these new devices will be affected by fundamental and engineering

Innovative Approaches to Combat Healthcare-Associated Infections Using Efficacy Standards Developed Through Industry and Federal Collaboration

October 5, 2018
Author(s)
Dianne L. Poster, Carl C. Miller, Yaw S. Obeng, Michael T. Postek, Troy E. Cowan, Richard A. Martinello
Nation-wide, healthcare-associated infections (HAIs) infect one in every 25 hospital patients, account for more than 100,000 deaths and increase medical costs by around $96-147B, each year. Ultraviolet-C (UV-C) antimicrobial devices are shown to reduce the

Virtual Metrology White Paper - INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS(IRDS)

April 9, 2018
Author(s)
Ndubuisi G. Orji, Yaw S. Obeng, Carlos Beitia, Supika Mashiro, James Moyne
This white paper provides an overview of virtual metrology (VM) and the benefits it can provide, with cost reduction (both capital expenditure and cycle time) being the primary benefit. The white paper also examines some of the issues preventing wider

Remote Bias Induced Electrostatic Force Microscopy for Subsurface Imaging

March 5, 2018
Author(s)
Joseph J. Kopanski, Lin You, Yaw S. Obeng
Contrast in electrostatic force microscopy (EFM) depends on the electrostatic force between the tip and sample. In the related technique, scanning Kelvin force microscopy (SKFM), contrast arises from the force due to the capacitance gradient with tip-to

Microwave Evaluation of Electromigration Susceptibility in Advanced Interconnects

November 1, 2017
Author(s)
Yaw S. Obeng, Kin P. Cheung, Dmitry Veksler, Christopher E. Sunday
Traditional metrology has been unable to adequately address the needs of emerging integrated circuits (ICs) at the nano scale; thus, new metrology and techniques are needed. For example, the reliability challenges in fabrication need to be well understood

The Impact of Organic Additives On Copper Trench Microstructure

June 28, 2017
Author(s)
James B. Marro, Chukwudi A. Okoro, Yaw S. Obeng, Kathleen C. Richardson
Organic additives are typically used in the pulse electrodeposition of copper (Cu) to prevent void formation during the filling of high aspect ratio features. In this work, the role of bath chemistry as modified by organic additives was investigated for