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Search Publications by: Yaw S. Obeng (Fed)

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Displaying 101 - 125 of 172

Electromagnetic Field Test Structure Chip for Back End of the Line Metrology

March 23, 2015
Author(s)
Lin You, Jungjoon Ahn, Emily Hitz, Jonathon Michelson, Yaw S. Obeng, Joseph J. Kopanski
A test chip to produce known and controllable gradients of surface potential and magnetic field at the chip surface and suitable for imaging with various types of scanning probe microscopes is presented. The purpose of the test chip is to evaluate various

Influence of Metal?MoS2 Interface on MoS2 Transistor Performance: Comparison of Ag and Ti Contacts

December 16, 2014
Author(s)
Hui H. Yuan, Guangjun Cheng, Lin You, Haitao Li, Hao Zhu, Wei Li, Joseph J. Kopanski, Yaw S. Obeng, Angela R. Hight Walker, David J. Gundlach, Curt A. Richter, D. E. Ioannou, Qiliang Li
In this work, we present a study of enhancing MoS2 transistor performance by using proper metal contact. We found that the on-state current of MoS2 field-effect transistors with 30 nm Au/ 30 nm Ag contacts is enhanced more than 60 times and the

Broad-Band Microwave-Based Metrology Platform Development: Demonstration of In-Situ Failure Mode Diagnostic Capabilities for Integrated Circuit Reliability Analyses

November 7, 2014
Author(s)
Lin You, Chukwudi A. Okoro, Jungjoon Ahn, Joseph Kopanski, Yaw S. Obeng, Rhonda R. Franklin
In this paper, we discuss the use of broadband high frequency electromagnetic waves (RF) to non- destructively identify, classify and characterize performance-limiting defects in emerging nanoelectronic devices. As an illustration, the impact of thermal

Defect and Microstructural Evolution in Thermally Cycled Cu Through-Silicon Vias

June 14, 2014
Author(s)
Chukwudi A. Okoro, James Marro, Yaw S. Obeng, Kathleen Richardson
In this study, the effect of thermal cycling on defect generation, microstructure, and the RF signal integrity of blind Cu through-silicon via (TSV) were investigated. Three different thermal cycling profiles were used; each differentiated by their peak

Scanning Probe Microscopes for Subsurface Imaging

May 11, 2014
Author(s)
Joseph J. Kopanski, Lin You, Jungjoon Ahn, Emily Hitz, Yaw S. Obeng
Scanning probe microscopes (SPMs) have some ability to image sub-surface structures. This paper describes the theoretical and practical basis for imaging metal lines buried beneath insulating layers and for imaging insulating regions or voids within metal

Development of a Methodology to Determine Risk of Counterfeit Use

June 5, 2013
Author(s)
Mark Schaffer, Yaw S. Obeng
Counterfeit components have become a multi-million dollar, yet undesirable, part of the electronics industry. The profitability of the counterfeit industry rests in large part on its ability to recognize supply constraints and quickly respond, effectively